| 1/28/2022 | 8515190000 | SOLDERING IRON FOR HIGH-TEMPERATURE AND LOW-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD COMPONENTS ON PRINTED BOARDS. OPERATING TEMPERATURE RANGE 240-540 C. | 1.32 | 189.9 | Malaysia | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515190000 | SOLDERING IRON FOR LOW-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD-COMPONENTS ON PRINTED BOARDS. OPERATING TEMPERATURE RANGE 200-480 C. CONSISTS OF BODY, CERAMIC HEATER, TIP, CONNECTING CABLE. | 2.19 | 768.31 | Malaysia | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515190000 | SOLDERING STATION FOR LOW-TEMPERATURE AND HIGH-TEMPERATURE SOLDERING FOR MOUNTING SMD-COMPONENTS ON PRINTED BOARDS. | 29.04 | 1392.11 | Malaysia | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515190000 | SOLDERING IRON FOR LOW-TEMPERATURE AND HIGH-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD COMPONENTS ON PRINTED BOARDS. NOT MILITARY PURPOSE. IS NOT A WELDING EQUIPMENT. NOT FOR MEDICINE. | 1.56 | 175.47 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/19/2022 | 8515190000 | TECHNOLOGICAL EQUIPMENT FOR THE ELECTRICAL INDUSTRY: INSTALLATION FOR SOLDERING OF SURFACE MOUNTED COMPONENTS ON JT PRINTED BOARDS BY THE METHOD REFLOW SOLDERING . | 2882 | 178861.1 | China | SHENZHEN CHINA | CLOVER TECHNOLOGY LLC |