| 1/28/2022 | 8515190000 | SOLDERING IRON FOR HIGH-TEMPERATURE AND LOW-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD COMPONENTS ON PRINTED BOARDS. OPERATING TEMPERATURE RANGE 240-540 C. | 1.32 | 189.9 | Malaysia | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515190000 | SOLDERING IRON FOR LOW-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD-COMPONENTS ON PRINTED BOARDS. OPERATING TEMPERATURE RANGE 200-480 C. CONSISTS OF BODY, CERAMIC HEATER, TIP, CONNECTING CABLE. | 2.19 | 768.31 | Malaysia | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515190000 | SOLDERING STATION FOR LOW-TEMPERATURE AND HIGH-TEMPERATURE SOLDERING FOR MOUNTING SMD-COMPONENTS ON PRINTED BOARDS. | 29.04 | 1392.11 | Malaysia | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515110000 | THERMAL POUCHES FOR MOUNTING AND DISMANTLING SMD COMPONENTS ON PRINTED BOARDS IN SMD AND SOP TYPE FLAT CASES. | 1.54 | 397.68 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515110000 | SOLDERING IRONS AND SOLDERING GUNS FOR LOW-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD-COMPONENTS ON PRINTED BOARDS. | 0.5 | 148.21 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515110000 | THERMAL POUCHES FOR MOUNTING AND DISMANTLING SMD COMPONENTS ON PRINTED BOARDS IN SMD AND SOP TYPE FLAT CASES. | 0.14 | 110.42 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515110000 | THERMAL POUCHES FOR MOUNTING AND DISMANTLING SMD COMPONENTS ON PRINTED BOARDS IN SMD AND SOP TYPE FLAT CASES. | 0.21 | 73.19 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515110000 | SOLDERING IRON FOR SOLDERING HIGH DENSITY PRINTED MULTILAYER PRINTED BOARDS, FOR MOUNTING SMD-COMPONENTS ON PRINTED BOARDS. CONSISTS OF BODY, CERAMIC HEATER, TIP, CONNECTING CABLE. | 0.1 | 29.46 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515110000 | THERMAL POUCHES FOR MOUNTING AND DISMANTLING SMD COMPONENTS ON PRINTED BOARDS IN SMD AND SOP TYPE FLAT CASES. | 0.15 | 88.25 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
| 1/28/2022 | 8515190000 | SOLDERING IRON FOR LOW-TEMPERATURE AND HIGH-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD COMPONENTS ON PRINTED BOARDS. NOT MILITARY PURPOSE. IS NOT A WELDING EQUIPMENT. NOT FOR MEDICINE. | 1.56 | 175.47 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |