1/26/2022 | 8542323900 | ELECTRONIC INTEGRATED MONOLITHIC DYNAMIC RANDOM MEMORY (DOSES, DRAM). (NOT A SCRAP OF ELECTRICAL EQUIPMENT, NOT RADIATION RESISTANT). APPLICATION: CONSTRUCTION OF RADIO ELECTRONIC EQUIPMENT FOR | 0.03 | 55.75 | Thailand | HONG KONG | ONSHOR WIND LLC |
1/5/2022 | 8542323900 | INTEGRATED MONOLITHIC, DYNAMIC RANDOM MEMORY DEVICES (DRAM MEMORY) VOLUME 4 GBIT, IN PLASTIC CASE FBGA-96, FOR MOUNTING ON A PRINTED BOARD. USED FOR MANUFACTURE OF RADIO-ELECTRONIC EQUIPMENT. | 0.05 | 1526.87 | South Korea | HONG KONG | T COMPONENT SP LLC |
1/31/2022 | 8542323900 | ELECTRONIC INTEGRATED MONOLITHIC DYNAMIC RANDOM MEMORY (DOSES, DRAM). (NOT A SCRAP OF ELECTRICAL EQUIPMENT, NOT RADIATION RESISTANT). APPLICATION: CONSTRUCTION OF RADIO ELECTRONIC EQUIPMENT FOR | 2.03 | 9457.77 | Taiwan | KIRKLAND UNITED STATES | MACRO GROUP LLC |
1/26/2022 | 8542323900 | ELECTRONIC INTEGRATED MONOLITHIC DYNAMIC RANDOM MEMORY (DOSES, DRAM). (NOT A SCRAP OF ELECTRICAL EQUIPMENT, NOT RADIATION RESISTANT). APPLICATION: CONSTRUCTION OF RADIO ELECTRONIC EQUIPMENT FOR | 0.24 | 471.38 | United States of America | HONG KONG | ONSHOR WIND LLC |
1/5/2022 | 8542323900 | MONOLITHIC INTEGRAL CIRCUIT, MEMORY, VOLUME 2 GB, IN PLASTIC CASE TSOP-86, FOR MOUNTING ON A PRINTED BOARD. USED FOR MANUFACTURE OF RADIO-ELECTRONIC EQUIPMENT. | 0.04 | 604.63 | China | HONG KONG | T COMPONENT SP LLC |
1/12/2022 | 8542323900 | MONOLITHIC INTEGRATED MICROCIRCUIT: DDR3L DYNAMIC MEMORY CHIP, FOR MOUNTING ON PRINTED BOARDS, WITHOUT CONTENT OF ENCRYPTION (CRYPTOGRAPHIC) MEANS, NON-MILITARY PURPOSE, NOT SCRAP OF ELECTRICAL EQUIPMENT, NOT RADIO-RESISTANT | 7.59 | 102341.4 | South Korea | ST PETERSBURG RUSSIA | MT SYSTEMS LLC |
1/31/2022 | 8542323900 | MONOLITHIC INTEGRATED MICROCIRCUIT: DDR3L DYNAMIC MEMORY CHIP, FOR MOUNTING ON PRINTED BOARDS, WITHOUT CONTENT OF ENCRYPTION (CRYPTOGRAPHIC) MEANS, NON-MILITARY PURPOSE, NOT SCRAP OF ELECTRICAL EQUIPMENT, NOT RADIO-RESISTANT | 0.42 | 6543.1 | South Korea | ST PETERSBURG RUSSIA | MT SYSTEMS LLC |
1/19/2022 | 8542323900 | MONOLITHIC INTEGRATED MICROCIRCUIT: DDR3L DYNAMIC MEMORY CHIP, FOR MOUNTING ON PRINTED BOARDS, WITHOUT CONTENT OF ENCRYPTION (CRYPTOGRAPHIC) MEANS, NON-MILITARY PURPOSE, NOT SCRAP OF ELECTRICAL EQUIPMENT, NOT RADIO-RESISTANT | 0.64 | 9814.3 | South Korea | ST PETERSBURG RUSSIA | MT SYSTEMS LLC |
1/12/2022 | 8542323900 | MONOLITHIC INTEGRATED MICROCIRCUIT: DDR3L DYNAMIC MEMORY CHIP, FOR MOUNTING ON PRINTED BOARDS, WITHOUT CONTENT OF ENCRYPTION (CRYPTOGRAPHIC) MEANS, NON-MILITARY PURPOSE, NOT SCRAP OF ELECTRICAL EQUIPMENT, NOT RADIO-RESISTANT | 0.64 | 8570.4 | South Korea | ST PETERSBURG RUSSIA | MT SYSTEMS LLC |