1/6/2022 | 4411929000 | HDF BRAND BOARDS, DENSITY MORE THAN 0.8 G/CM3, THICKNESS 8 MM, WITH A LAMINATED PAPER SURFACE, COATED WITH VARNISH, MACHINED (ENDS ARE PROFILED IN LENGTH), IN SHEETS, USED AS A FLOOR COVERING. | 20770.1 | 17758.8 | Poland | ZARY | STROYTECH LLC |
1/22/2022 | 4410113000 | Chipboard, PATTERNED PAPER, IMPREGNATED WITH MELAMINE, STRUCTURE-CHIPPER FRACTION, GLUED AND PRESSED, EDGES NOT PROFILED, ENDS NOT PROCESSED, WITH NON-ORIENT. CHIP, FOR MANUFACTURE OF FURNITURE. THE PLATE IS ASSEMBLED IN PACKS, WHICH ARE PLACED ON A CASTING SHEET OF CHIPBOARD WITH | 17549.2 | 8388.85 | Poland | GRAJEWO PL | MVM PLUS LLC |
1/19/2022 | 4411929000 | BOARDS OF HDF BRAND, DENSITY MORE THAN 0.8 G/CM3, THICKNESS 8 MM, WITH LAMINATED PAPER SURFACE, COATED WITH VARNISH, MACHINED (ENDS PROFILED IN LENGTH), IN SHEETS, USED AS FLOOR COVERING | 20996.7 | 18479.8 | Poland | ZARY | STROYTECH LLC |
1/17/2022 | 4411929000 | BOARDS OF HDF BRAND, DENSITY MORE THAN 0.8 G/CM3, THICKNESS 8 MM, WITH LAMINATED PAPER SURFACE, COATED WITH VARNISH, MACHINED (ENDS PROFILED IN LENGTH), IN SHEETS, USED AS FLOOR COVERING | 20930.4 | 18147.9 | Poland | ZARY | STROYTECH LLC |