1/28/2022 | 8515190000 | DISMANTLING STATION FOR LOW TEMPERATURE SOLDERING FOR DISMANTLING SMD COMPONENTS ON PRINTED BOARDS. INCLUDED: STATION, DISMANTLING DEVICE, REPLACEABLE TUBE FILTER, KEY CARD, POWER CABLE, CONNECTING CABLE, STAND FOR SOLDERING IRON WITH O | 12.55 | 1101.14 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515110000 | SOLDERING IRONS AND SOLDERING GUNS FOR LOW-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD-COMPONENTS ON PRINTED BOARDS. | 0.5 | 148.21 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515110000 | SOLDERING IRON FOR SOLDERING HIGH DENSITY PRINTED MULTILAYER PRINTED BOARDS, FOR MOUNTING SMD-COMPONENTS ON PRINTED BOARDS. CONSISTS OF BODY, CERAMIC HEATER, TIP, CONNECTING CABLE. | 0.1 | 29.46 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515190000 | SOLDERING IRON FOR LOW-TEMPERATURE AND HIGH-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD COMPONENTS ON PRINTED BOARDS. NOT MILITARY PURPOSE. IS NOT A WELDING EQUIPMENT. NOT FOR MEDICINE. | 1.56 | 175.47 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515110000 | SOLDERING IRON FOR LOW-TEMPERATURE SOLDERING OF PRINTED BOARDS WITH AUTONOMOUS POWER SUPPLY, FOR MOUNTING SMD COMPONENTS ON PRINTED BOARDS. SOLDERING TEMPERATURE MORE THAN 300 C. COMPOSITE HEAD, REMOVABLE BATTERY CONTAINER AND PROTECTIVE COVER. A SOURCE | 0.11 | 27.85 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |