1/25/2022 | 8523511000 | SEMICONDUCTOR MEDIA, SOLID-STATE NON-VOLUNTARY DATA STORAGE DEVICES, NON-WRITTEN, NOT CRASHED, NOT FOR PRIVATE RECEIVING INFORMATION, CIVIL PRIM., IN INDIV. BLISTER. PACKAGES, PADDED WITH FOAM AND PACKED IN CARDBOARD. BOXES, | 2.29 | 2402.7 | Azerbaijan | BAKU | SAMSUNG ELECTRONICS RUS COMPANY LLC |
1/14/2022 | 8529904900 | CASES FOR THE INDUSTRIAL ASSEMBLY OF SAMSUNG ELECTRIC APPLIANCES, EACH UNIT IS PLACED IN ITS OWN CELL AND PADDED WITH POLYETHYLENE SHEETS TO PREVENT SCRATCHES, IN CARDBOARD BOXES (THREE-LAYER CARDBOARD) OF INCREASED DENSITY AND THICKNESS FOR | 4 | 186.65 | Slovakia | Koryakovo | SAMSUNG ELECTRONICS RUS COMPANY LLC |
1/14/2022 | 8529904900 | CASES FOR THE INDUSTRIAL ASSEMBLY OF SAMSUNG ELECTRIC APPLIANCES, EACH UNIT IS PLACED IN ITS OWN CELL AND PADDED WITH POLYETHYLENE SHEETS TO PREVENT SCRATCHES, IN CARDBOARD BOXES (THREE-LAYER CARDBOARD) OF INCREASED DENSITY AND THICKNESS FOR | 4.16 | 231.75 | Slovakia | Koryakovo | SAMSUNG ELECTRONICS RUS COMPANY LLC |
1/14/2022 | 8529904900 | CASES FOR THE INDUSTRIAL ASSEMBLY OF SAMSUNG ELECTRIC APPLIANCES, EACH UNIT IS PLACED IN ITS OWN CELL AND PADDED WITH POLYETHYLENE SHEETS TO PREVENT SCRATCHES, IN CARDBOARD BOXES (THREE-LAYER CARDBOARD) OF INCREASED DENSITY AND THICKNESS FOR | 3.4 | 52.04 | Slovakia | Koryakovo | SAMSUNG ELECTRONICS RUS COMPANY LLC |
1/14/2022 | 8529904900 | CASES FOR THE INDUSTRIAL ASSEMBLY OF SAMSUNG ELECTRIC APPLIANCES, EACH UNIT IS PLACED IN ITS OWN CELL AND PADDED WITH POLYETHYLENE SHEETS TO PREVENT SCRATCHES, IN CARDBOARD BOXES (THREE-LAYER CARDBOARD) OF INCREASED DENSITY AND THICKNESS FOR | 22.5 | 906.79 | Slovakia | Koryakovo | SAMSUNG ELECTRONICS RUS COMPANY LLC |