1/21/2022 | 8542319010 | CENTRAL PROCESSOR (CPU) INTEL CORE I7-6700TE 2.40 GHz (SKYLAKE), 8 MB L3 CACHE (L3), THICKNESS 14 NM, 64 BITS, FOR INSTALLATION IN SOCKET 1151 / H4 / LGA1151 ) BOARD, SUPPLY VOLTAGE 1.4 V SW | 0.72 | 4279.59 | Malaysia | ST PETERSBURG RUSSIA | NIEHSHANTS PROMAVTOMATIKA LLC |
1/28/2022 | 8542319010 | CENTRAL PROCESSOR (CPU) INTEL CORE I3-4330 3.50 GHz (HASWELL), 4 MB L3 CACHE (L3), THICKNESS 22 NM, 64 BITS, FOR INSTALLATION IN SOCKET 1150 / H3 / LGA1150 BOARD), SUPPLY VOLTAGE 1.4 VDC | 0.05 | 129.67 | Malaysia | ST PETERSBURG RUSSIA | NIEHSHANTS PROMAVTOMATIKA LLC |
1/28/2022 | 8542319010 | CENTRAL PROCESSOR (CPU) INTEL CORE I7-6700TE 2.40 GHz (SKYLAKE), 8 MB L3 CACHE (L3), THICKNESS 14 NM, 64 BITS, FOR INSTALLATION IN SOCKET 1151 / H4 / LGA1151 ) BOARD, SUPPLY VOLTAGE 1.4 V SW | 0.19 | 1154.31 | Malaysia | ST PETERSBURG RUSSIA | NIEHSHANTS PROMAVTOMATIKA LLC |
1/14/2022 | 8542319010 | CENTRAL PROCESSOR (CPU) INTEL CORE I7-4770S 3.10 GHz (HASWELL), 8 MB L3 CACHE (L3), THICKNESS 22 NM, 64 BITS, FOR INSTALLATION IN SOCKET 1150 / H3 / LGA1150 ) BOARD, POWER SUPPLY 1.4V PIC | 0.34 | 1982.82 | Malaysia | ST PETERSBURG RUSSIA | NIEHSHANTS PROMAVTOMATIKA LLC |
1/14/2022 | 8542319010 | CENTRAL PROCESSOR (CPU) INTEL CORE I5-6500 3.20 GHz (SKYLAKE), 6 MB L3 CACHE (L3), THICKNESS 14 NM, 64 BITS, FOR INSTALLATION IN SOCKET 1151 / H4 / LGA1151 ) BOARD, SUPPLY VOLTAGE 1.4 VDC | 0.24 | 888.76 | Malaysia | ST PETERSBURG RUSSIA | NIEHSHANTS PROMAVTOMATIKA LLC |
1/14/2022 | 8542319010 | CENTRAL PROCESSOR (CPU) INTEL CORE I7-7700T 2.90 GHz (KABY LAKE), 8 MB L3 CACHE (L3), THICKNESS 14 NM, 64 BIT CAPACITY, FOR INSTALLATION IN SOCKET 1151 / H4 / LGA1151 CPU SOCKET ( MOTHER BOARDS, POWER SUPPLY 1.4 V P | 0.05 | 296.85 | Malaysia | ST PETERSBURG RUSSIA | NIEHSHANTS PROMAVTOMATIKA LLC |
1/10/2022 | 8542319010 | CHIP MODULES D50 1K 4B, THICKNESS 0.38MM. QUANTITY - 1000000 PIECES. USED IN VARIOUS PLASTIC MEMORY CARDS. CHIPS ARE A MICROELECTRONIC DEVICE IN THE FORM OF A THIN PLATE, MANUFACTURED ON A SEMICONDUCTOR SUBSTRATE. | 21 | 29178.2 | China | MOSCOW A P Sheremetyeva | OPEN KART LLC |
1/10/2022 | 8542319010 | CHIP MODULES ICODE SLI-X2, THICKNESS 0.38MM. QUANTITY - 500000 PIECES. USED IN VARIOUS PLASTIC MEMORY CARDS. CHIPS ARE A MICROELECTRONIC DEVICE IN THE FORM OF A THIN PLATE, MANUFACTURED ON A SEMICONDUCTOR SUBSTRATE. | 11 | 41753.2 | China | MOSCOW A P Sheremetyeva | OPEN KART LLC |