1/28/2022 | 8515110000 | THERMAL POUCHES FOR MOUNTING AND DISMANTLING SMD COMPONENTS ON PRINTED BOARDS IN SMD AND SOP TYPE FLAT CASES. | 1.54 | 397.68 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515110000 | THERMAL POUCHES FOR INSTALLATION AND DISMANTLING OF SMD COMPONENTS ON PRINTED BOARDS IN FLAT CASES OF SMD AND SOP TYPE, TEMPERATURE RANGE 200-400 GR. FROM, | 2.28 | 411.23 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515190000 | DISMANTLING STATION FOR LOW TEMPERATURE SOLDERING FOR DISMANTLING SMD COMPONENTS ON PRINTED BOARDS. INCLUDED: STATION, DISMANTLING DEVICE, REPLACEABLE TUBE FILTER, KEY CARD, POWER CABLE, CONNECTING CABLE, STAND FOR SOLDERING IRON WITH O | 12.55 | 1101.14 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515110000 | SOLDERING IRONS AND SOLDERING GUNS FOR LOW-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD-COMPONENTS ON PRINTED BOARDS. | 0.5 | 148.21 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515110000 | THERMAL POUCHES FOR MOUNTING AND DISMANTLING SMD COMPONENTS ON PRINTED BOARDS IN SMD AND SOP TYPE FLAT CASES. | 0.14 | 110.42 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515110000 | THERMAL POUCHES FOR MOUNTING AND DISMANTLING SMD COMPONENTS ON PRINTED BOARDS IN SMD AND SOP TYPE FLAT CASES. | 0.21 | 73.19 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515110000 | SOLDERING IRON FOR SOLDERING HIGH DENSITY PRINTED MULTILAYER PRINTED BOARDS, FOR MOUNTING SMD-COMPONENTS ON PRINTED BOARDS. CONSISTS OF BODY, CERAMIC HEATER, TIP, CONNECTING CABLE. | 0.1 | 29.46 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515190000 | REPAIR SOLDERING MULTIFUNCTIONAL STATION FOR LOW-TEMPERATURE SOLDERING, FOR INSTALLATION AND DISMANTLING OF SMD-COMPONENTS ON PRINTED BOARDS. | 11.14 | 1248.26 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515110000 | THERMAL POUCHES FOR MOUNTING AND DISMANTLING SMD COMPONENTS ON PRINTED BOARDS IN SMD AND SOP TYPE FLAT CASES. | 0.15 | 88.25 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |
1/28/2022 | 8515190000 | SOLDERING IRON FOR LOW-TEMPERATURE AND HIGH-TEMPERATURE SOLDERING OF PRINTED BOARDS, FOR MOUNTING SMD COMPONENTS ON PRINTED BOARDS. NOT MILITARY PURPOSE. IS NOT A WELDING EQUIPMENT. NOT FOR MEDICINE. | 1.56 | 175.47 | Japan | OSAKA | SCIENTIFIC AND PRODUCTION FIRM DIPOL JSC |