1/26/2022 | 8542399010 | MULTILAYER MONOLITHIC INTEGRATED MICROCIRCUIT WITH BUILT-IN POWER TRANSISTORS, DIODES AND RESISTORS. IT IS MANUFACTURED ON A SEMICONDUCTOR SUBSTRATE AND PLACED IN A NON-REMOVABLE CASE MADE FROM DIELECTRIC MATERIAL - PLASTIC. | 3.64 | 1690.11 | China | RYAZAN OBLAST | NPP TEPLOVODOKHRAN LLC |
1/26/2022 | 8542399010 | MULTILAYER MONOLITHIC INTEGRATED MICROCIRCUIT WITH BUILT-IN POWER TRANSISTORS, DIODES AND RESISTORS. IT IS MANUFACTURED ON A SEMICONDUCTOR SUBSTRATE AND PLACED IN A NON-REMOVABLE CASE MADE FROM DIELECTRIC MATERIAL - PLASTIC. | 3.56 | 1325.42 | China | RYAZAN OBLAST | NPP TEPLOVODOKHRAN LLC |
1/26/2022 | 8542399010 | MULTILAYER MONOLITHIC INTEGRATED MICROCIRCUIT WITH BUILT-IN POWER TRANSISTORS, DIODES AND RESISTORS. IT IS MANUFACTURED ON A SEMICONDUCTOR SUBSTRATE AND PLACED IN A NON-REMOVABLE CASE MADE FROM DIELECTRIC MATERIAL - PLASTIC. | 5.78 | 1301.96 | China | RYAZAN OBLAST | NPP TEPLOVODOKHRAN LLC |
1/26/2022 | 8542399010 | MULTILAYER MONOLITHIC INTEGRATED MICROCIRCUIT WITH BUILT-IN POWER TRANSISTORS, DIODES AND RESISTORS. IT IS MANUFACTURED ON A SEMICONDUCTOR SUBSTRATE AND PLACED IN A NON-REMOVABLE CASE MADE FROM DIELECTRIC MATERIAL - PLASTIC. | 116.91 | 66519.9 | China | RYAZAN OBLAST | NPP TEPLOVODOKHRAN LLC |
1/24/2022 | 8542399010 | MULTILAYER MONOLITHIC INTEGRATED MICROCIRCUIT WITH BUILT-IN POWER TRANSISTORS, DIODES AND RESISTORS. IT IS MANUFACTURED ON A SEMICONDUCTOR SUBSTRATE AND PLACED IN A NON-REMOVABLE CASE MADE FROM DIELECTRIC MATERIAL - PLASTIC. | 1 | 1915.57 | China | CHANGZHOU CHINA | NPP TEPLOVODOKHRAN LLC |
1/10/2022 | 8542319010 | CHIP MODULES D50 1K 4B, THICKNESS 0.38MM. QUANTITY - 1000000 PIECES. USED IN VARIOUS PLASTIC MEMORY CARDS. CHIPS ARE A MICROELECTRONIC DEVICE IN THE FORM OF A THIN PLATE, MANUFACTURED ON A SEMICONDUCTOR SUBSTRATE. | 21 | 29178.2 | China | MOSCOW A P Sheremetyeva | OPEN KART LLC |
1/10/2022 | 8542319010 | CHIP MODULES ICODE SLI-X2, THICKNESS 0.38MM. QUANTITY - 500000 PIECES. USED IN VARIOUS PLASTIC MEMORY CARDS. CHIPS ARE A MICROELECTRONIC DEVICE IN THE FORM OF A THIN PLATE, MANUFACTURED ON A SEMICONDUCTOR SUBSTRATE. | 11 | 41753.2 | China | MOSCOW A P Sheremetyeva | OPEN KART LLC |