1/26/2022 | 3920995900 | PLASTIC BOARDS, NON-SELF-ADHESIVE, NON-REINFORCED, NON-POROUS, NON-LAMINATED, OF POLY-FOUNDATION PRODUCTS, WITH VERTICAL EDGES, NOT COMBINED WITH OTHER MATERIALS, FOR USE IN A WINDOW AND DOOR MANUFACTURER: | 49 | 228.08 | Finland | YLIHARMA | SKAALA LLC |
1/21/2022 | 3921903000 | CHIPBOARD BOARD WITH LAMINATED PAPER SURFACE (EGGER WORKTOPS AND WALL PANELS), END FINISHED WITH EDGING MATERIAL (PLASTIC EDGES). APPLIED IN THE FURNITURE INDUSTRY | 6073.45 | 13416.9 | Austria | BISCUTER | MEGAPLIT NN LLC |
1/26/2022 | 3921131000 | FLEXIBLE POLYURETHANE PLATES, INTENDED FOR LEVELING THE FLOOR SUBSTRATE (SCREED) WHEN INSTALLING FLOOR COVERINGS FROM LAMINATED PANELS AND PARQUET BOARD, DOES NOT CONTAIN OZONE DEPLETING SUBSTANCES. | 3741.36 | 6808.82 | Poland | VITEBSK | POL HALL LLC |
1/26/2022 | 3921110000 | POROUS PLATES FROM STYRENE POLYMERS INTENDED FOR LEVELING THE FLOOR SUBSTRATE (SCREED) IN THE DEVICE OF FLOOR COVERINGS FROM LAMINATED PANELS AND PARQUET BOARDS, DOES NOT CONTAIN OZONE DEPLETING SUBSTANCES. | 2225.42 | 13175.5 | Poland | VITEBSK | POL HALL LLC |
1/19/2022 | 3921110000 | POROUS PLATES FROM STYRENE POLYMERS INTENDED FOR LEVELING THE FLOOR SUBSTRATE (SCREED) IN THE DEVICE OF FLOOR COVERINGS FROM LAMINATED PANELS AND PARQUET BOARDS, DOES NOT CONTAIN OZONE DEPLETING SUBSTANCES. | 3429.24 | 22845.5 | Poland | VITEBSK | POL HALL LLC |
1/19/2022 | 3921110000 | POROUS PLATES FROM STYRENE POLYMERS INTENDED FOR LEVELING THE FLOOR SUBSTRATE (SCREED) IN THE DEVICE OF FLOOR COVERINGS FROM LAMINATED PANELS AND PARQUET BOARDS, DOES NOT CONTAIN OZONE DEPLETING SUBSTANCES. | 501.7 | 3548.96 | Poland | VITEBSK | POL HALL LLC |
1/19/2022 | 3921131000 | FLEXIBLE POLYURETHANE PLATES, INTENDED FOR LEVELING THE FLOOR SUBSTRATE (SCREED) WHEN INSTALLING FLOOR COVERINGS FROM LAMINATED PANELS AND PARQUET BOARD, DOES NOT CONTAIN OZONE DEPLETING SUBSTANCES. | 2272.6 | 4256.67 | Poland | VITEBSK | POL HALL LLC |
1/11/2022 | 3926909709 | THERMAL SUBSTRATE FROM SILICONE ELASTOMER LAMINATED WITH A THIN HEAT-CONDUCTING REINFORCING MATERIAL. DESIGNED TO IMPROVE THERMAL CONDUCTIVITY, REMOVE AIR GAPS BETWEEN DC/DC CONVERTERS AND BOARDS, HEAT Sinks AND RADIATORS WITHOUT | 2.3 | 5469.73 | United States of America | CHAMPLAIN USA | PIT LOGISTICS LLC |