1/18/2022 | 7419800000 | COPPER BAR, FOIL OF ELECTROLYTIC (OXYGEN-FREE) COPPER GRADE E-CU58, THICKNESS 0.05 MM, COATED ON BOTH SIDES WITH SOLDER L-SN60PB (TIN 60% + LEAD) FOR CORROSION PROTECTION | 516.5 | 57046.1 | Ireland | WATERFORD IRELAND | AGC BORSKY GLASS FACTORY JSC |
1/21/2022 | 7419800000 | COPPER BAR, FOIL OF ELECTROLYTIC (OXYGEN-FREE) COPPER GRADE E-CU58, THICKNESS 0.05 MM, COATED ON BOTH SIDES WITH SOLDER L-SN60PB (TIN 60% + LEAD) FOR CORROSION PROTECTION | 466.9 | 51689.4 | Ireland | WATERFORD IRELAND | AGC BORSKY GLASS FACTORY JSC |
1/11/2022 | 8311300000 | LEAD FREE ROHS LF FLUX CORE SOLDER FOR LOW TEMPERATURE SOLDERING IN ASSEMBLY OF CIVIL CELLULAR COMMUNICATION SYSTEMS WITHOUT PRECIOUS METALS | 1000 | 72662.3 | China | VORSINO KALUZSKI REGION | TELECONTA LLC |
1/31/2022 | 3810100000 | SOLDERING PASTE FOR SOLDERING PCB BOARDS IS A CLEAN-FREE GEL FLUX FOR SOLDERING ELECTRONIC COMPONENTS USING LEAD-FREE AND LEAD-CONTAINING SOLDERS. THE FLUX HAS SUFFICIENT STICKING TO KEEP MICROCIRCUIT CASES ON THE BOARD | 4 | 1178.05 | Hungary | EKATERENBURG | ISKRATELURAL LTD RUSSIA ON ORDER OF ISKRATEL DOO LYUBLYANSKA S 24A SLOVENIA |
1/28/2022 | 3810909000 | KESTER 186 FLUX-PEN FOR SOLDERING, LEAD-CONTAINING AND LEAD-FREE TECHNOLOGIES ASSEMBLY OF STANDARD BOARDS, SURFACE MOUNTED BOARDS, COMPOSITION ISOPROPANOL 55-70-%, ROSIN MODIFIED 10-25%, GASOLINE PART 5 | 0.11 | 109.87 | United States of America | Unknown | REPRESENTATIVE OFFICE OF THE COMPANY SCHLUMBERGER LOGELCO INC PANAMA MOSCOW |