1/26/2022 | 8543708000 | MANUAL SYSTEM FOR ULTRASONIC CLEANING OF Stencils FROM RESIDUES OF SOLDER PASTE OR ADHESIVE USED IN THE PRODUCTION OF PRINTED BOARDS | 37.8 | 7731.32 | United Kingdom | VILNIUS AIRPORT LITHUANIA | TLF LLC |
1/26/2022 | 8479899707 | MANUAL SCREEN PRINTING PRINTER FOR MANUAL APPLICATION OF SOLDER PASTE ON PRINTED BOARDS BY SCREEN PRINTING METHOD | 26.1 | 2061.48 | Germany | VILNIUS AIRPORT LITHUANIA | TLF LLC |
1/25/2022 | 7326909409 | STEEL CLICHES, ASSORTED; TOTAL 4 PIECE; ARE EQUIPMENT FOR SCREEN PRINTING MACHINES AND ARE INTENDED FOR APPLICATION OF SOLDER PASTE ON PRINTED DIAGRAM (BOARDS); MADE OF STAINLESS (CORROSION-RESISTANT) STEEL 304 BY METHOD | 2.87 | 207.95 | China | TOMSK | FIZTECH ENERGO JSC |
1/21/2022 | 8443194000 | SCREEN PRINTERS DESIGNED FOR APPLYING SOLDER PASTE TO PRINTED BOARDS BY THE SCREEN PRINTING METHOD | 200 | 2009.52 | China | SHANGHA CHINA | KAMELIA LLC |
1/21/2022 | 8479899707 | MACHINES WITH INDIVIDUAL FUNCTIONS DESIGNED FOR THE MANUFACTURE OF PRINTED BOARDS: AUTOMATIC SOLDER PASTE DISPENSER. OPERATING PRINCIPLE: THE DISPENSER DELIVERS THE SOLDER PASTE TO PRE-MARKED POINTS ON THE PRINT TECHNICAL CHARACTERISTICS: ELECTRIC | 70 | 217.48 | China | SHANGHA CHINA | KAMELIA LLC |
1/19/2022 | 8443197000 | AUTOMATIC SCREEN PRINTER, DESIGNED FOR APPLICATION OF SOLDER PASTE ON PRINTED BOARDS, NOT PRINTING EQUIPMENT: | 1650 | 119354.1 | South Korea | GYEONGGI DO REPUBLIC OF KOREA | SMTTECH LLC |
1/10/2022 | 8479820000 | AUTOMATIC MIXER FOR PREPARATION OF SOLDER PASTE KAYO-500S. INTENDED FOR PREPARATION (MIXING) OF SOLDER PASTE FOR APPLICATION ON CONTACT PADS OF PRINTED BOARDS. FOR THE NEEDS OF OWN PRODUCTION LLC DIS ELECTRONIC SOLUTIONS . | 45 | 498.2 | China | WUXI | DIS ELECTRONIC SOLUTIONS LLC |
1/4/2022 | 3810100000 | SOLDERING PASTE FOR AUTOMATIC SCREEN PRINTING ON ELECTRONIC BOARD BLANKS, USED FOR APPLICATION ON CONTACT PADS OF PRINTED BOARDS.TOTAL: 50 CANS | 23.6 | 1592.72 | China | SUIFENHE CHINA | FAST IMPORT LLC |
1/23/2022 | 3810100000 | PASTE FOR LOW-TEMPERATURE SOLDERING, CONSISTING OF METAL, ETC. MATERIALS NOT IN AEROSIS. PACKAGING, NOT FOR RETAIL, NOT A WASTE OF PRODUCTION, NOT FOR FIRE EXTINGUISHING, USED AS AUXILIARY MATERIAL IN THE PRODUCTION AND (OR) REPAIR OF PRINTED BOARDS | 500 | 30281.5 | South Korea | INCHEON AIRPORT IN KOREA | ECOVIS INTERNATIONAL LLC |
1/31/2022 | 3810100000 | SOLDERING PASTE IS USED FOR APPLICATION ON CONTACT PADS OF PRINTED BOARDS FOR FURTHER INSTALLATION OF ELECTRONIC COMPONENTS. THE PASTE IS A READY MIXTURE OF FLUX WITH TIN (BASE BASE) FROM ALLOY, PACKED IN CANS OF 0.5 | 100 | 3047.67 | China | SHENZHEN CHINA | UPZ PROMSVYAZ JSC |